示例机型：

HDL-8500/8510

应用领域Application：

适用于硅、陶瓷、玻璃、砷化镓、磷化铟、各类引线框架/基板类封装体的切割等材料的切割，全系列兼容6-12寸晶圆。

Blade saw applied for silicon, ceramic, gallium arsenide, and various materials like lead-frame and substrate, compatible with 6-12 inch wafer.

主要特点Main Features：

●外观尺寸追求小型化，占地面积小，切割行程大；

Miniaturized size and occupied area, but with huge working range;

●配备NCS、BBD、漏液检测模块、远程控制模块，智能化、高效化适应客户需求；

Equipped with NCS (Non-Contact Setup) block, BBD (blade break detect) block and weeping detecting block, adapt to customer's requirements intelligently and efficiently;

●大功率主轴，高速高精度电机，大幅提高生产效率；

High power spindle, high speed & high precision motor, highly increase the yield;

●高效的自动对准，自动刀痕识别以及崩边检测功能；

Efficient auto-focus, auto cutting line recognition and chipping detection function;

●多种切割模式任意选择，配有数据管理和日志管理系统，随时监控生产状况；

Switch to various cutting mode arbitrarily, with data management and log management system, easy to monitor the manufacture process at any time;

●配备17英寸触屏显示器，呈现更多信息。

Equipped with 17 inch touch screen, getting more information during the working process.

主要参数Main Parameters：

主轴功率 (Spindle Power)	1.5/1.8/2.4kw可选 (Optional for 1.5/1.8/2.4kw)
X轴最大返程速度 (X Axis Maximum Speed)	800mm/s
X轴直线度 (X Axis Straightness)	±0.001mm/250mm
Y轴重复步进精度 (Y Axis Repeat Stepping Precision)	0.001以内/5mm
Z轴重复精度 (Z Axis Repeating Precision)	0.001mm
θ轴重复定位精度 (θ Axis Repeat Positioning Accuracy)	0.001deg
θ轴定位精度(θ Axis Repeating Accuracy)	0.002deg
视觉系统(Vision System)	高倍/低倍/双倍显微镜可选 (Optional for high power/low power/double microscope)
主要功能(Main Functions)	自动对准，自动对焦，寻边识别，刀痕识别，崩边检测，NCS、BBD、漏液检测 （Auto Alignment, Auto Focus, Edge Recognition, Cutting line Recognition, Chipping Detection, Non-Contact Setup, Blade Break Detection, Weeping Detection）

实例效果Sample Effect：